Mentor Graphics' acquisition of Zeland Software was among the big news coming out of DesignCon 2010 last week.
The conference and exhibition,which spans chip, package, board and system domains, addresses common issues in signal integrity, power management, interconnection and design verification, took place this past week at the Santa Clara Convention Center
Microwave Journal is pleased to announce the 2nd annual RF/Microwave Zone pavilion at CTIA Wireless 2010. This dedicated pavilion features industry leading companies that provide components, integrated circuits, test, measurement and simulation tools as the essential ingredients for today's wireless applications and tomorrow's emerging technologies.
Now you can find solutions to your high frequency design challenges in one convenient location.
GSMA Mobile World Congress 2010 February 15-18, 2010 Montjuic
LTE Broadband Wireless Access February 16, 2010 Free 1-hour Webinar
Satellite 2010 March 15-18, 2010 National Harbor
CTIA Wireless 2010 March 23-25, 2010 Las Vegas
Hittite Microwave Corp. has introduced its 24th product line, Power Conditioning, ideal for low noise voltage regulation in automotive telematics, cellular/4G, WiMAX/4G, military and test equipment applications.
JFW Industries Inc.:75 Ohm Programmable Attenuator, 75P-167 The new 75P-167 from JFW Industries is our latest solid-state, 75 ohm programmable attenuator. It offers 127 dB of dynamic range with 1 dB resolution. Specifically designed for DOCSIS and MoCA testing, it operates from 800 to 2200 MHz and switches attenuation settings in less than 2 microseconds.
MECA Electronics Inc.:707 Series Hybrid Divider/Combiners MECA Electronics introduces the 707 series, medium power, 180 degree hybrid divider/combiner. Designed to cover wireless bands from 0.400 to 6.000 GHz in 10% bandwidths with average RF power handling capability of 150 W (1 kW peak). The 707 series is weather proof and meets IP65 and is ideally suited for high or medium power dividing or combining applications; measures 2.5" x 2" X.82”.
American Microwave Corp.:PIN Diode Switch SWNN-3DR-06T The engineers and technicians at AMC have worked together to develop a new PIN diode switch circuit that allows for excellent insertion loss and isolation. Initial configurations will be SPST and SP3T. AMC Model Number SWNN-3DR-06T is a SP3T Reflective Solid State PIN Diode Switch with very low loss. Designed to work in various MIL bands, it includes TTL control logic and SMA female connectors for input and output.
Electronic Assembly Manufacturing (EAM):NEW Flexible Cable Assemblies EAM has recently announced the release of low VSWR flexible cable assemblies featuring Times Microwave Systems T-Flex® cable. Three-foot long, 0.141” diameter assemblies, terminated with SMA male connectors, exhibit VSWR characteristics of 1.35:1 from 45 MHz to 18 GHz. Suitable for applications through 20 GHz, these 50 ohm flexible cable assemblies meet all MIL-C-17 requirements.
Mimix Broadband Inc.:XR1019-QH Receiver A 27 to 34 GHz QFN packaged receiver with a noise figure of 2.5 dB and 13 dB conversion gain. This receiver integrates a low noise amplifier, image reject mixer and LO buffer amplifier within a fully molded 4x4mm QFN package, making the device easy to install and handle in volume applications. It is ideal for wireless communications applications such as point-to-point microwave radio, LMDS, SatCom and VSAT.
Mini-Circuits:ZABT-2R15G+ Bias-Tee/Diplexer A combination bias tee and diplexer designed specifically for satellite communications and wireless infrastructure applications. The ZABT-2R15G combines solid Mini-Circuits bias tee performance with additional functionality to inject 10 MHz reference clock without additional components. Built in a rugged shielded case, it is equipped with SMA connectors for the L-Band ports and BNC connectors for DC and 10 MHz.
Shoichi Nakagawa outlines Mitsubishi Electric’s evolution from its inception in 1921, explains the company’s commitment to environmental issues that began in the 1960s, and identifies the technological developments that are set to take the company into the next decade.
Mike Lincoln of TriQuint Semi- conductor discusses the advantages of GaN RF technology available through modules and other packaged products, die-level devices and foundry services, the technological alternatives to GaN and why engineers should consider Gallium Nitride for their next design.
Ansoft introduces a new Integral Equation option to HFSS, the 3D finite element electromagnetic solver.The HFSS-IE solver will complement HFSS as a comprehensive antenna design solution
Agilent's new N7609B software with PXB/MXG can be combined with the company's 8960 Wireless Communications Test Set in the GS-9000 A-GPS Design Verification Test System for complete A-GPS pre-conformance test coverage.
The conference and exhibition,which spans chip, package, board and system domains, addresses common issues in signal integrity, power management, interconnection and design verification, took place this past week at the Santa Clara Convention Center
Hittite Microwave Corp. has introduced its 24th product line, Power Conditioning, ideal for low noise voltage regulation in automotive telematics, cellular/4G, WiMAX/4G, military and test equipment applications.
The new 75P-167 from JFW Industries is our latest solid-state, 75 ohm programmable attenuator. It offers 127 dB of dynamic range with 1 dB resolution. Specifically designed for DOCSIS and MoCA testing, it operates from 800 to 2200 MHz and switches attenuation settings in less than 2 microseconds.
MECA Electronics introduces the 707 series, medium power, 180 degree hybrid divider/combiner. Designed to cover wireless bands from 0.400 to 6.000 GHz in 10% bandwidths with average RF power handling capability of 150 W (1 kW peak). The 707 series is weather proof and meets IP65 and is ideally suited for high or medium power dividing or combining applications; measures 2.5" x 2" X.82”. 
The engineers and technicians at AMC have worked together to develop a new PIN diode switch circuit that allows for excellent insertion loss and isolation. Initial configurations will be SPST and SP3T. AMC Model Number SWNN-3DR-06T is a SP3T Reflective Solid State PIN Diode Switch with very low loss. Designed to work in various MIL bands, it includes TTL control logic and SMA female connectors for input and output.
EAM has recently announced the release of low VSWR flexible cable assemblies featuring Times Microwave Systems T-Flex® cable. Three-foot long, 0.141” diameter assemblies, terminated with SMA male connectors, exhibit VSWR characteristics of 1.35:1 from 45 MHz to 18 GHz. Suitable for applications through 20 GHz, these 50 ohm flexible cable assemblies meet all MIL-C-17 requirements.
A 27 to 34 GHz QFN packaged receiver with a noise figure of 2.5 dB and 13 dB conversion gain. This receiver integrates a low noise amplifier, image reject mixer and LO buffer amplifier within a fully molded 4x4mm QFN package, making the device easy to install and handle in volume applications. It is ideal for wireless communications applications such as point-to-point microwave radio, LMDS, SatCom and VSAT.
A combination bias tee and diplexer designed specifically for satellite communications and wireless infrastructure applications. The ZABT-2R15G combines solid Mini-Circuits bias tee performance with additional functionality to inject 10 MHz reference clock without additional components. Built in a rugged shielded case, it is equipped with SMA connectors for the L-Band ports and BNC connectors for DC and 10 MHz.
Shoichi Nakagawa outlines Mitsubishi Electric’s evolution from its inception in 1921, explains the company’s commitment to environmental issues that began in the 1960s, and identifies the technological developments that are set to take the company into the next decade. 
Mike Lincoln of TriQuint Semi- conductor discusses the advantages of GaN RF technology available through modules and other packaged products, die-level devices and foundry services, the technological alternatives to GaN and why engineers should consider Gallium Nitride for their next design.
