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A Systems Mentality Drives Next Generation MMIC Design
September 14, 2010; 11am ET
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Innovations in EDA: Discrete Oscillator Design
September 16, 2010; 1 pm ET
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Passive Component Technology
September 21, 2010; 11am ET
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The Masters of MIMO

August 10, 2010
SATIMO (Nicolas Gross. Alessandro Scannavini and Meryam Abou el Anouar)
MI Technologies (Derek Skousen)

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Solving the RFIC Design for Yield and Verification Dilemma


July 14, 2010
Paul Colestock
RFIC Product Manager
Agilent EEsof EDA


today’s highly integrated RFICs for digital wireless communications. Along the way, we will look at this problem from the foundry, EDA and designer perspectives to hopefully give a comprehensive picture of where we are today and what choices exist to improve RFIC verification and design for yield.

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III-V Processes: Integration is the Future


June 15, 2010
GaAs Foundry Services
Derek Smith
Director of Marketing and Sales
OMMIC


Derek considers the standing of III-V processes in the technological landscape, both now and in the future and how higher performance, higher integration and integrated options, together with more stringent requirements, have not only made III-V devices essential today but are ensuring that they wil...

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At Last: Exciting Times in the Microwave Point-to-Point Market


May 7, 2010
Bob VanBuskirk
President and CEO, RFMD
RFMD


Microwave Point-to-Point radio links, typically used in cellular backhaul applications, are getting an unprecedented amount of interest from the cellular industry. As cellular networks transition from voice-centric to data-centric services, the need for improved performance in radio links for wir...

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Electromagnetic System Simulation with HFSS HPC


April 9, 2010
3D EM Simulation
Alain Michel
Technical Director


Alain Michel of Ansoft France, a division of ANSYS Inc., discusses how to get more out of HFSS when designing antenna arrays through circuit co-simulation featuring “push” excitation capability and complete electromagnetic system simulation with HFSS HPC.

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RF Component Level Modeling for System Level Simulation


March 12, 2010
Wayne Struble
M/A-COM Distingished Fellow of Technology


Wayne Struble, Distinguished Fellow of Technology at M/A-COM Technology Solutions, discusses various approaches to modeling RF components including IP encryption, behavioral and X-parameter based models, model extraction, simulation speed, ease of end use, model accuracy and model l...

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RF Inductor Selection Tool Speeds Circuit Design


February 10, 2010
Inductors
Len Crane
Technical Marketing Manager


Len Crane, Technical Marketing Manager at Coilcraft, has over 30 years of inductor design experience. He talks about a new interactiveonline inductor selection tool that helps engineers compare inductors and their critical performance data such as Q, equivalent series resistance and self-resonant fr...

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Is GaN the New RF "Superman"?


January 1, 2010
Semiconductors
Mike Lincoln
TriQuint Semiconductor Product Marketing


Mike Lincoln of TriQuint Semi- conductor discusses the advantages of GaN RF technology available through modules and other packaged products, die-level devices and foundry services, the technological alternatives to GaN and why engineers should consider Gallium Nitride for their next design.

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I'm Just an Engineer


December 8, 2009
Active Components
Ferenc Marki


"The fact that constant innovation leads to success in the engineering business is obvious. What is not obvious, however, is that the current economic and socio-scientific climate makes the microwave industry ripe for engineering-minded entrepreneurs."

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De-mystifying Single Carrier FDMA: The New LTE Uplink

Thin Dielectric Materials

RF/Microwave Zone Floorplan

CTIA Wireless Central Hall Floorplan

Super-regenerative Receiver

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